Joseph Fjelstad has been active in electronics manufacturing since 1972 in various roles, including chemist, process engineer, and R&D manager. He holds nearly 190 U.S. Patents and numerous foreign ones. He is an internationally recognized expert, inventor and lecturer in the field of electronics interconnection technology and a veteran of several startup companies, including: Beta Phase, ELF Technologies, MetaRAM, Silicon Pipe, and Tessera (now the public company, Xperi).

Some of Fjelstad’s innovative devices and novel reliability improving IC packaging structural features are found in nearly every electronic device made today. He is also an author, co-author or editor of several books on interconnection technology, including Flexible Circuit Technology 4th Edition, the most widely distributed reference book on the topic, Chip Scale Packaging for Modern Electronics, and Solderless Assembly For Electronics — The SAFE Approach (a book on the Occam Process). In addition, Fjelstad has written hundreds of articles, columns and commentaries for various industry magazines and journals over the last five decades.

Joe has been cited to date over 10,000 times on Google Scholar and is ranked both nationally and international among the best electronics and electrical engineering scientists globally by Research.com